High modulus polyimide blend

Details High modulus polyimide blend High modulus polyimide blend

1998-04-07

1999-08-17

Acquah, Samuel A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

528350, 528351, 528353, 525420, 525540, 26421112, 264330, 26433111, C08L 7700

Patent

active

059394986

ABSTRACT:
An intimate polyimide blend, prepared by chemical conversion, containing from 25 to 50 weight % of a first polyimide derived from 90 to 100 mole % of 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 0 to 10 mole % of pyromellitic dianhydride and p-phenylenediamine and from 50 to 75 weight % of a second polyimide derived from pyromellitic dianhydride, from 20 to 50 mole % of p-phenylenediamine and from 50 to 80 mole % of 4,4'-diaminodiphenylether. The polyimide blend provides blister free films having high modulus and low thermal expansion coefficients for use in electronics applications.

Affiliated with

Also associated with

Rating

High modulus polyimide blend does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High modulus polyimide blend, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High modulus polyimide blend will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-315496