Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1980-12-31
1983-12-06
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228180A, 228198, B23K 3102
Patent
active
044188579
ABSTRACT:
Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of Group IB metal to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. An Au preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing materials to add Ni and Au to the melt almost simultaneously.
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Ainslie Norman G.
Krzanowski James E.
Palmateer Paul H.
Godici Nicholas P.
Hodak Marc
International Business Machines Corp.
Jones Graham S.
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