High melting point copper-gold-tin brazing alloy for chip carrie

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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428672, H05K 706

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active

046346384

ABSTRACT:
Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of copper to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. A copper preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing material to add Ni and copper to the melt.

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patent: 4360142 (1982-11-01), Carpenter
patent: 4418857 (1983-12-01), Ainslee
patent: 4465223 (1984-08-01), Cammarano et al.

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