High-k dual dielectric stack

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07834426

ABSTRACT:
The present invention discloses a method including: providing a Group III-V component semiconductor material; forming a first layer over a surface of the Group III-V component semiconductor material, the first layer to unpin a Fermi level at the surface; forming a second layer over the first layer, the second layer for scaling an equivalent oxide thickness (EOT); and annealing the first layer before or after forming the second layer to remove bulk trap defects in the first layer.

REFERENCES:
patent: 4811077 (1989-03-01), Fowler et al.
patent: 7163860 (2007-01-01), Kamal et al.
patent: 2003/0137018 (2003-07-01), Passlack et al.
patent: 2003/0219994 (2003-11-01), Goodhue
patent: 2006/0131652 (2006-06-01), Li
patent: 2007/0069240 (2007-03-01), Passlack
patent: 2007/0082505 (2007-04-01), Abrokwah et al.
patent: 2008/0003752 (2008-01-01), Metz et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-k dual dielectric stack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-k dual dielectric stack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-k dual dielectric stack will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4243863

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.