High isolation packaging method

Details High isolation packaging method High isolation packaging method

1992-01-21

1993-06-29

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 29841, 174 35R, 333 12, H05K 334

Patent

active

052222942

ABSTRACT:
A microwave circuit high isolation packaging technology involving the fabrication of a single-piece baseplate containing microwave circuits, the fabrication of a single-piece framework, and the assembly of the baseplate structure to the framework structure eliminating any gaps. The baseplate contains the desired microwave circuitry without isolation channels or other impediments to mounting circuit components or making circuit interconnections. The framework comprises all isolation walls, transoms, or other structures capable of isolating individual portions of the microwave circuit when assembled to the baseplate.

REFERENCES:
patent: 3816911 (1974-06-01), Knappenberger
patent: 4370515 (1983-01-01), Donaldson
patent: 4626963 (1986-12-01), Spees
patent: 4717990 (1988-01-01), Tugcu
patent: 4816613 (1989-03-01), Ito et al.
patent: 4861941 (1989-08-01), Kubo et al.
patent: 4903169 (1990-02-01), Kitagawa et al.
patent: 4974317 (1990-12-01), Rodriguez et al.
patent: 5097389 (1992-03-01), Ito et al.

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