High-impedance substrate, antenna device and mobile radio...

Communications: radio wave antennas – Antennas – Antenna components

Reexamination Certificate

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C343S702000, C343S846000

Reexamination Certificate

active

07623087

ABSTRACT:
There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.

REFERENCES:
patent: 6262495 (2001-07-01), Yablonovitch et al.
patent: 2003/0010529 (2003-01-01), Sievenpiper et al.
patent: 2003/0112186 (2003-06-01), Sanchez et al.
patent: 2004/0160367 (2004-08-01), Mendolia et al.
patent: 2005/0029632 (2005-02-01), McKinzie et al.
patent: 2005/0068233 (2005-03-01), Tanaka et al.
patent: 2002-510886 (2002-04-01), None
patent: 2003-529261 (2003-09-01), None
patent: 2004-535720 (2004-11-01), None
patent: 2005-79794 (2005-03-01), None
patent: 2005-94360 (2005-04-01), None
patent: 2005-110273 (2005-04-01), None
patent: WO94/13029 (1994-06-01), None
patent: WO 94/13029 (1994-06-01), None
patent: WO 99/50929 (1999-10-01), None
patent: WO 01/73893 (2001-10-01), None
patent: WO 02/41447 (2002-05-01), None
patent: WO 03/007427 (2003-01-01), None
patent: WO 2008/020249 (2008-02-01), None
U.S. Appl. No. 12/170,733, filed Jul. 10, 2008, Sekine, et al.
U.S. Appl. No. 12/188,522, filed Aug. 8, 2008, Inoue, et al.
Hisamatsu Nakano, et al., “A Dual-Frequency Spiral Antenna”, Institute of Electronics, Information and Communication Engineers General Meeting B-1, Mar. 3, 2003, p. 135.
U.S. Appl. No. 12/410,768, filed Mar. 25, 2009, Suetsuna, et al.
Japanese Office Action with English, Jul. 4, 2009.

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