High impedance substrate

Details High impedance substrate High impedance substrate

2006-07-04

2006-07-04

Chen, Shih-Chao (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C343S895000

Reexamination Certificate

active

07071876

ABSTRACT:
A high-impedance substrate including a first layer made of insulating material, having a lower face and an upper face, the substrate including conductor patterns mechanically linked to the substrate. Some of the conductor patterns mechanically linked to the substrate are associated with a magnetic tile. At least one electrical interconnection puts two points distinct from one another of a conductor pattern mechanically linked to the substrate in electrical contact, this conductor pattern having an assigned magnetic tile, passing above the magnetic tile associated with the conductor pattern mechanically linked to the substrate.

REFERENCES:
patent: 5561438 (1996-10-01), Nakazawa et al.
patent: 6384797 (2002-05-01), Schaffner et al.
patent: 2003/0048234 (2003-03-01), Alexopoulos et al.
patent: 2004/0263420 (2004-12-01), Werner et al.
patent: 2005/0030137 (2005-02-01), McKinzie et al.
patent: 1 195 847 (2002-04-01), None
patent: 58-137206 (1983-08-01), None
patent: 02/071544 (2002-09-01), None

Affiliated with

Also associated with

Rating

High impedance substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High impedance substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High impedance substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3597693