High impact rubber modified polystyrene and polyphenylene ether

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

525 67, 525 68, 525 92, 525151, 525152, C08K 551, C08L 6900, C08L 7104

Patent

active

048248878

ABSTRACT:
Disclosed are thermoplastic compositions of improved mold flow comprising a polyphenylene ether resin and novel rubber modified polystyrenes containing dispersed rubbery particles having a maximum mean diameter of about 2.0 microns and a ratio of the volume average particle size
umber average particle size of from not substantially less than 2.00 up to 3.20. Articles molded from the composition have vastly improved surface gloss and ductile impact strength in comparison with conventional polyphenylene/high impact rubber modified polystyrene compositions.

REFERENCES:
patent: 4128602 (1978-12-01), Katchman et al.
patent: 4128603 (1978-12-01), Katchman et al.
patent: 4128604 (1978-12-01), Katchman et al.
patent: 4448931 (1984-05-01), Sugio et al.
patent: 4513120 (1985-04-01), Bennett, Jr. et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High impact rubber modified polystyrene and polyphenylene ether does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High impact rubber modified polystyrene and polyphenylene ether , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High impact rubber modified polystyrene and polyphenylene ether will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1196277

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.