High heat density transfer device

Heat exchange – Heat transmitter

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 802, 16510433, 257720, 361705, 361708, F28F 700, F28D 1502

Patent

active

055667520

ABSTRACT:
Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

REFERENCES:
patent: 3678995 (1972-07-01), Collard
patent: 3721289 (1973-03-01), Seal
patent: 3828848 (1974-08-01), Custers et al.
patent: 3974518 (1976-08-01), Lewis, Jr. et al.
patent: 4582954 (1986-04-01), Eaton et al.
patent: 4966226 (1990-10-01), Hamburgen
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5224030 (1993-06-01), Banks et al.
patent: 5390734 (1995-02-01), Voorhes et al.
K. V. Ravi, "Low Pressure Diamond Synthesis for Electronic Applications," Materials Science and Engineering, B19 (1993), pp. 203-227.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High heat density transfer device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High heat density transfer device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High heat density transfer device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2352247

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.