High heat density transfer device

Details High heat density transfer device High heat density transfer device

1997-02-05

1998-10-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 257720, 361717, 428901, H05K 720

Patent

active

058256245

ABSTRACT:
Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

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Research Disclosure, #(No.) 288, Apr. 1988, England, p. 1, "Electrical Resistive --Chips".
K. V. Ravi, "Low Pressure Diamond Synthesis for Electronic Applications," Materials Science and Engineering, B19 (1993), pp. 203-227.

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