High heat-conductive, thick film multi-layered circuit board

Details High heat-conductive, thick film multi-layered circuit board High heat-conductive, thick film multi-layered circuit board

1990-01-04

1992-06-16

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361386, H05K 111

Patent

active

051229307

ABSTRACT:
High heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region, the circuit board comprising: a substrate having high heat conductivity; an oxidized layer formed on a surface of said substrate; an electrically conductive layer formed of a printed paste containing therein crystallized glass; and an insulating layer formed of a printed insulating paste comprised of crystallized glass as a principal constitutent, wherein at least one of said conductive layer and at least one of said insulating layer are alternately disposed by printing on the oxidized layer of said substrate, and said conductive and insulating layers have been heated to form solid layers. The substrate is AlN, SiC/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductively of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulating layer has a low dielectric constant.

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