High heat conductive body and wiring base substrate fitted with

Details High heat conductive body and wiring base substrate fitted with High heat conductive body and wiring base substrate fitted with

1994-02-14

1996-08-13

Robinson, Ellis

Compositions: ceramic

Ceramic compositions

Refractory

428632, 428688, 428702, 252512, 252515, 75232, 75235, 75248, B32B 1700

Patent

active

055455980

ABSTRACT:
Disclosed is a high heat conductive body which consists of 30-99 wt. % of at least one of molybdenum and tungsten and 1 or more wt. % ceramic. A wiring base substrate fitted with such a high heat conductive body is also disclosed. Methods of producing such a high heat conductive body and a wiring base substrate are further disclosed.

REFERENCES:
patent: 4072532 (1978-02-01), Fletcher
patent: 4109377 (1978-08-01), Blazick et al.
patent: 4485150 (1984-11-01), Tsumo
patent: 4734233 (1988-03-01), Toda
patent: 5060049 (1991-10-01), Yamasaki
patent: 5099388 (1992-03-01), Ogawa
patent: 5164246 (1992-11-01), Tamaka
patent: 5293069 (1994-03-01), Kato

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