High-frequency-transmission printed wiring board, probe card, an

Details High-frequency-transmission printed wiring board, probe card, an High-frequency-transmission printed wiring board, probe card, an

1995-11-08

1998-05-05

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

333 33, 333246, G01R 3102

Patent

active

057480060

ABSTRACT:
A probe card for examining the electrical characteristics of a plurality of IC chips formed on a semiconductor wafer has a card body and a printed wiring board. The card body has contact elements for contacting the electrodes pads of each IC chip. The printed wiring board has a plurality of transmission paths for transmitting a high-frequency signal to the contact elements. The printed wiring board has a plurality of signal lines disposed between first and second insulating layers, and first and second reference conductive plates opposing the signal lines through the first and second insulating layers, respectively. DC potentials that are different from each other are applied to the first and second reference conductive plates. The first and second reference conductive plates are arranged to be substantially offset from each other along each transmission path. The first and second reference conductive plates are arranged to slightly overlap each other. The overlapping amount is adjusted such that the impedances of the respective transmission paths are equal as a whole.

REFERENCES:
patent: 4757256 (1988-07-01), Whann et al.
patent: 4891612 (1990-01-01), Gleason et al.
patent: 5003273 (1991-03-01), Oppenberg
patent: 5148103 (1992-09-01), Pasiecznik, Jr.
patent: 5225037 (1993-07-01), Elder et al.
patent: 5311406 (1994-05-01), Snodgrass et al.
patent: 5422579 (1995-06-01), Yamaguchi

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