High frequency stripline blade probe device and method of probin

Details High frequency stripline blade probe device and method of probin High frequency stripline blade probe device and method of probin

1995-09-05

1999-09-28

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 3100

Patent

active

059594608

ABSTRACT:
An apparatus for probing high frequency electronic devices in wafer form comprising a high frequency wafer probe (16,56) having a conductor (36,61), a dielectric layer (37,71,72), a grounding layer (38,81,82,91), a signal probe needle (39,86), and a pair of ground needles (43,72,76) coupled to a substrate (11,51). A plurality of high frequency wafer probes (16,56) can be coupled to the substrate (11,51) to probe high density high frequency electronic devices and to probe high frequency electronic devices having varying bonding pad layouts. The high frequency wafer probe (16,56) is less sensitive to varying bonding pad height. The apparatus is suitable for probing high frequency electronic devices in a wafer manufacturing environment.

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patent: 3560907 (1971-02-01), Heller
patent: 4791363 (1988-12-01), Logan
patent: 4871964 (1989-10-01), Boll et al.
patent: 4894612 (1990-01-01), Drake et al.
patent: 5291129 (1994-03-01), Kazama
patent: 5565788 (1996-10-01), Burr et al.

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