High frequency sonic substrate processing module

Details High frequency sonic substrate processing module High frequency sonic substrate processing module

1989-08-21

1991-05-21

Pal, Asok

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134184, B08B 700

Patent

active

050172360

ABSTRACT:
A single substrate high frequency sonic processing module uses a substrate chamber dimensionally sized to the substrate for immersing the substrate in processing solution. Sonic wave permeable membranes form two ends of the substrate chamber along a sonic wave path therethrough. A sonic wave generated by a transducer external to the substrate chamber, travels through sonic wave conducting liquid in contact with the first membrane, external to the substrate chamber. The liquid is shaped by a sonic wave guide of continuously diminishing cross sectional area along the sonic wave path therethrough, thus intensifying and concentrating the sonic wave entering the substrate chamber. The sonic wave passes through the second membrane to a sonic absorbing and dissipating ante chamber. A method for sonic processing of substrates is disclosed. The individual sonic processing modules are combined into a single system for simultaneously processing plural substrates. The minimal sized substrate chamber provides effective processing with minimal processing solution, minimizing cost and disposal. The shaped wave guide concentrates and intensifies the sonic wave guide to provide enhanced processing.

REFERENCES:
patent: 3893869 (1975-07-01), Mayer et al.
patent: 4118649 (1978-10-01), Shwartzman et al.
patent: 4326553 (1982-04-01), Hall
patent: 4461651 (1984-07-01), Hall
patent: 4543130 (1985-09-01), Shwartzman
patent: 4736760 (1988-04-01), Coberly et al.
patent: 4763677 (1988-08-01), Miller
patent: 4804007 (1989-02-01), Bran

Affiliated with

Also associated with

Rating

High frequency sonic substrate processing module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High frequency sonic substrate processing module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High frequency sonic substrate processing module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-235623