Wave transmission lines and networks – Long lines
Patent
1993-03-31
1994-09-20
Gensler, Paul
Wave transmission lines and networks
Long lines
333238, 333260, H01P 300, H01P 308
Patent
active
053493176
ABSTRACT:
A high frequency signal transmission tape for connecting a plurality of high frequency IC chips to each other or connecting a high frequency IC chip to a signal transmission line disposed on a package includes an insulating thin film having a surface; a conductive signal line disposed on the surface; and two conductive grounding lines disposed on the surface on opposite sides of, parallel to, and spaced from the signal line. The signal transmission tape produces small reflection and attenuation of signals in an extremely high frequency band, i.e., a millimeter-wave frequency band over 30 GHz. Therefore, high frequency IC chips arbitrarily arranged on a package are easily connected using the high frequency signal transmission tape.
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"20 GHz Band MMIC Modules Assembled By Impedance-Matched Film Carrier", Autumn National Convention Record, The Institute of Electronics, Information and Communication Engineers, 1989.
Katoh Takayuki
Notani Yoshihiro
Gensler Paul
Mitsubishi Denki & Kabushiki Kaisha
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