High frequency signal transmission structure

Wave transmission lines and networks – Long line elements and components – Strip type

Reexamination Certificate

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Details

C333S263000, C333S033000

Reexamination Certificate

active

07012490

ABSTRACT:
A connection pad, an insulating film, a ground layer a protective film, first to third wirings and posts S0, S1, G, D on the wirings are disposed on a semiconductor substrate. In this case, the first wiring transmits a high frequency signal, and a dummy pad portion and dummy post D for restraining attenuation of the high frequency signal are disposed midway in the wiring and not connected to external, circuits. An opening for decreasing a floating capacity is disposed in the ground layer under the posts S0, D.

REFERENCES:
patent: 5872393 (1999-02-01), Sakai et al.
patent: 6255920 (2001-07-01), Ohwada et al.
patent: 6400234 (2002-06-01), Ohhaishi et al.
patent: 6479900 (2002-11-01), Shinogi et al.
patent: 6803664 (2004-10-01), Murayama
patent: 2001/0054939 (2001-12-01), Zhu et al.
patent: 2002/0036099 (2002-03-01), Hachiya
patent: 1 182 703 (2002-02-01), None
patent: 1 251 558 (2002-10-01), None
patent: 2002-124593 (2002-04-01), None

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