Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Patent
1997-06-18
1999-09-21
Martin-Wallace, Valencia
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
257692, 257693, 257694, 257695, 257696, 257697, H01L 2334, H01L 2352, H01L 2348
Patent
active
059557834
ABSTRACT:
A DBS receiver front end which includes a tuner chip and a demodulator/decoder chip. The tuner chip converts a receive signal to a baseband signal using a tuning frequency signal generated from a tank circuit. The design of a package for the tuner chip maximally spaces the pins associated with high frequency signals by placing them on opposite sides of the chip (in the case of two high frequency signal sources) or (in the case of three high frequency signal sources) in a triangle formation with widely spaced vertices wherein at least two of the pins are adjacent to corners of the package. For two or more high frequency signal sources, a good determination of pin locations can be determined according to the formula P.sub.i =C+i.multidot..left brkt-bot.N/M.right brkt-bot., i=1, . . . , M, where P.sub.i are the pin numbers, N is a total number of pins around the perimeter of the package, M is a total number of the high frequency signal sources, and C is an offset number. Where a high frequency signal source has more than one associated pin, one pin number is found from the above formula, and the associated pins are placed on adjacent pins.
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Ben-Efraim Nadav
Keate Christopher
Clark Jhihan B.
LSI Logic Corporation
Martin-Wallace Valencia
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