High frequency semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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Details

C257S636000, C257S637000, C257S758000, C257S759000, C257S665000, C257S662000, C257S664000

Reexamination Certificate

active

06853054

ABSTRACT:
A high frequency semiconductor device including wiring layers which are formed above a semiconductor substrate and in which transmission lines are formed by combining with a ground plate having a potential fixed at the ground potential, at least one crossing portion in which the wiring layers mutually cross, with insulating interlayers provided therebetween, and at least one separation electrode being selectively provided on one of the insulating interlayers, the at least one separation electrode having a potential fixed at the ground potential. Accordingly, in the high frequency semiconductor device, electrical interference between two crossing wiring layer is prevented and transmission loss is suppressed.

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Copy of Taiwanese Patent Office Action for corresponding Taiwanese Patent Application No. 91104614 dated May 9, 2003 with partial translation.
Copy of Japanese Patent Office Communication for corresponding Japanese Patent Application No. 2001-099954 dated May 20, 2003 with partial translation.

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