Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1990-05-24
1991-07-02
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 70, 357 72, 361421, H01L 2328, H05K 502
Patent
active
050287419
ABSTRACT:
A high frequency, low cost power semiconductor device (60) is provided by combining a semiconductor die (46) with a leadframe (10,12) having a coplanar upper surface (36) with thin external leads (18,20) and a thicker central die bond region (24) whose upper face (16) and sides (42) are covered by an encapsulation (52) but whose lower face (54) is exposed. The leadframe (10,12) desirably has an "H" pattern with the arms (18,20) extending laterally from opposed sides of the encapsulation (52) and down-formed to have their lower surfaces (62) coplanar with the exposed lower face (54) of the central die bond region (16,24) which forms the cross-bar of the "H". The leadframe is monolithic and preferably formed by skiving. The device is especially suited for surface-mounting.
REFERENCES:
patent: 3689683 (1972-09-01), Paletto et al.
patent: 4507675 (1985-03-01), Fujii
patent: 4942454 (1990-07-01), Mori et al.
patent: 4961105 (1990-10-01), Yamamoto
Pollock Randy
Sanders Paul W.
Handy Robert M.
Ledynh Bot L.
Motorola Inc.
Parsons Eugene A.
Picard Leo P.
LandOfFree
High frequency, power semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High frequency, power semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High frequency, power semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1248471