High-frequency power amplifier module

Amplifiers – With semiconductor amplifying device – Integrated circuits

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C330S302000, C330S310000

Reexamination Certificate

active

07088186

ABSTRACT:
A ground layer is provided between a first and a second wiring layer. A first transistor provided at the first wiring layer amplifies a supplied high-frequency signal. A second transistor provided at the first wiring layer amplifies the output signal of the first transistor. A first power supply line, which supplies power to the first transistor, is provided at the first wiring layer. A second power supply line, which supplies power to the second transistor, is provided at the second wiring layer.

REFERENCES:
patent: 6172567 (2001-01-01), Ueno et al.
patent: 6249186 (2001-06-01), Ebihara et al.
patent: 1061577 (2000-12-01), None
patent: 03-278701 (1991-12-01), None
patent: 10-197662 (1998-07-01), None
patent: 2000-357771 (2000-12-01), None
patent: 2002-141756 (2002-05-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-frequency power amplifier module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-frequency power amplifier module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-frequency power amplifier module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3642802

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.