High-frequency power amplifier

Details High-frequency power amplifier High-frequency power amplifier

2006-02-14

2006-02-14

Takaoka, Dean (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S260000

Reexamination Certificate

active

06998943

ABSTRACT:
A second strip conductor is located, in a lamination direction of a multilayer substrate, at a is different position from that of a first strip conductor. A first grounding conductor and a second grounding conductor are disposed sequentially in the lamination direction of the multilayer substrate and sandwich the first strip conductor and the second strip conductor. The first grounding conductor includes a first grounding conductor portion for a wiring prohibited area in which no wiring may be placed, and a second grounding conductor portion for an area other than the wiring prohibited area. The second grounding conductor portion is positioned, in the lamination direction of the multilayer substrate, at a location is different from that of the first grounding conductor portion.

REFERENCES:
patent: 5469130 (1995-11-01), Okada et al.
patent: 5808529 (1998-09-01), Hamre
patent: 6201439 (2001-03-01), Ishida et al.
patent: 6677839 (2004-01-01), Aruga
patent: 6753604 (2004-06-01), Hase et al.
patent: 62-140503 (1987-06-01), None
A. Inoue et al., “High-Efficiency 0.1 cc Power Amplifier Module for 900 MHz Personal Digital Cellular Telephones,”IEICE Trans. Electron., vol. E82-C(11), pp. 1906-1912, Nov. 1999.

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