High-frequency multilayer printed circuit board

Wave transmission lines and networks – Long lines – Strip type

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Details

361387, 361414, 156634, 156901, 427 96, H01P 308, H05K 306

Patent

active

048127922

ABSTRACT:
A circuit board having multiple layers of a dielectric material, multiple layers of a conductive metal and multiple layers of graphite bonded together to form a composite multilayer printed circuit board having a desired coefficient of expansion and having strip and microstrip transmission lines for electrically connecting very high frequency electronic components mounted on the circuit board. The multiple layers of graphite are positioned in a symmetrical manner with respect to the thickness of the circuit board and selected in number to provide the circuit board with a desired coefficient of expansion. In addition, at least some of the layers of graphite are positioned in close proximity to some of the layers of conductive metal to provide enhanced thermal conduction from the mounted components.

REFERENCES:
patent: 4047132 (1977-09-01), Krajewski
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4560962 (1985-12-01), Barrow
patent: 4591659 (1986-05-01), Leibowitz
patent: 4689110 (1987-08-01), Leibowitz

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