High frequency multilayer integrated circuit

Details High frequency multilayer integrated circuit High frequency multilayer integrated circuit

2008-04-08

2008-04-08

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S792000, C361S795000, C174S260000

Reexamination Certificate

active

11147332

ABSTRACT:
A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.

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