High-frequency multilayer circuit substrate

Details High-frequency multilayer circuit substrate High-frequency multilayer circuit substrate

2005-02-15

2005-02-15

Jones, Stephen E. (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S246000

Reexamination Certificate

active

06856210

ABSTRACT:
A high-frequency multilayer circuit substrate having a plurality of circuit layers includes a via hole for connection between the circuit layers, a metal pad, an impedance matching transmission line, rectangular stubs and a signal transmission line. A via hole connecting portion is constructed of the via hole, the rectangular stubs and the impedance matching transmission line. A characteristic impedance of the via hole connecting portion is matched to a characteristic impedance of the signal transmission line by adjusting widths and lengths of the impedance matching transmission line and the rectangular stubs. Thereby, the reflection of the signal wave in the via hole connecting portion is reduced to decrease a transmission loss.

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Hayt, Jr. ,William Engineering Electromagnetics, 1981, McGraw-Hill Book Company, 4thedition, pp. 454-455.

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