Wave transmission lines and networks – Long line elements and components – Strip type
Reexamination Certificate
2000-02-10
2002-03-19
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Long line elements and components
Strip type
C333S247000, C333S219100, C174S262000
Reexamination Certificate
active
06359536
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a high frequency electronic part and, in particular, to a high frequency module, such as a voltage control oscillator, a filter, an antenna duplexer, and an antenna module, which is used in the microwave band, the millimeter wave band, etc.
2. Description of the Related Art
As a result of the recent increase in the demand for mobile communications systems and the increase in the amount of information transmitted, the communication band for mobile communication is being expanded from the microwave band to the millimeter wave band. In constructing a dielectric filter, a voltage control oscillator (hereinafter referred to as “VCO”) or the like is sometimes employed which includes a dielectric resonator (operating in a TE01&dgr; mode) . The resonance frequency of an ordinary TE01 &dgr; mode dielectric resonator is determined by an outer diameter of a cylindrical dielectric member. The coupling of the resonator with a micro strip line or the like is determined by the distance therebetween,. Accordingly, a high level of accuracy in size and positioning is required.
In view of this, the present applicant has proposed, in Japanese Patent Application No. JP-A-7-62625, a dielectric resonator and a dielectric filter in which the above problem has been eliminated and which excel in machining accuracy.
In the dielectric resonator and the dielectric filter of the above-mentioned patent application, electrodes are formed on both main surfaces of a dielectric plate, whereby part of the dielectric plate is used as a dielectric resonator. In such a dielectric resonator, the electrodes formed on the dielectric plate can be used as a high frequency ground plane, so that, by forming a micro strip line on another dielectric sheet or the like and stacking it together with the dielectric plate, it is possible to form a high frequency module, such as a VCO, including a dielectric resonator and an electronic part.
FIG. 9
is a sectional view of an example of the construction of such a high frequency module. In the drawing, numeral
1
indicates a dielectric plate on both main surfaces of which electrodes are formed. Numeral
2
indicates a dielectric sheet, on the upper surface of which wiring patterns
4
and
5
are formed and which has a through-hole th having a land P at a predetermined position. An electronic part in the form of a chip
28
, is mounted on the land P. Wiring patterns
23
and
24
are connected to each other by a bonding wire w.
As shown in
FIG. 9
, by adopting a two-layered structure, composed of the dielectric plate
1
and the dielectric sheet
2
, it is possible to use the electrode
15
on the dielectric plate
1
as a high frequency ground plane, forming the wiring patterns
4
and
5
on the dielectric sheet
2
as a micro strip line.
However, when mounting an electronic part, such as an FET, the ground connection of the electronic part is effected through through-hole th shown in
FIG. 9
, so that the grounding path becomes rather long, which may have an adverse effect on the high frequency characteristics. Further, since an electronic part in the form of a chip is mounted on the land having a through-hole, the structure is rather poor in heat radiation property, so that it cannot be applied to an electronic part in which a great quantity of heat is generated.
The above problem exists not only in the case in which a dielectric resonator is formed in a part of the dielectric plate
1
, but is common to cases in which a dielectric sheet or the like is stacked on a base material having a high frequency ground surface to form a high frequency module.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a high frequency module in which the above problems have been eliminated.
There is provided, in accordance with the present invention, a high frequency module of the type which is formed by stacking on a base material having a high frequency ground surface a sheet material or a plate material on the surface of which a high frequency circuit is formed and which consists of a dielectric or an insulating material, wherein an electronic part constituting a part of the high frequency circuit, is mounted or formed on the base material, and wherein a hole through which the electronic part is exposed is provided in the sheet material or the plate material, an electrode of the electronic part being electrically connected to a conductor pattern on the sheet material or the plate material by means of a bonding wire through the hole.
FIG. 1
is a sectional view showing an example of the above construction. As shown in the drawing, an electronic part
28
is directly mounted on a high frequency ground surface
15
of a dielectric plate
1
, and a dielectric sheet
2
having a hole
11
through which this electronic part
28
is exposed is stacked on the dielectric plate
1
. The electrode of the electronic part
28
and conductor patterns
4
and
5
on the dielectric sheet
2
are connected to each other through bonding wires w.
Due to this construction, the electronic part is directly mounted or formed on the base material having a high frequency ground surface, so that the ground connection of the electronic part is reliably effected, and there is no adverse influence on the high frequency characteristics due to the increase in the length of the grounding path. Further, since the heat generated by the electronic part is directly conducted to the base material, a high heat radiation property is obtained, so that it has no adverse influence on the electronic part and the peripheral members. Further, since the electronic part is provided on the base material, it is possible to reduce the height (thickness) of the whole, making it possible to reduce the height of the entire high frequency module. Further, since the electronic part does not protrude from the surface of the dielectric sheet or, if it does, it does so only to a small degree, the electronic part is mechanically protected.
Further, in this invention, an electronic part constituting a part of the high frequency circuit is mounted on the base material, and a conductor pattern for connecting the electrode of the electronic part is formed thereon. A conductor pattern electrically connected to the above-mentioned conductor pattern and a through-hole through which the electronic part is inserted is provided in the sheet material or the plate material.
Further, in this invention, an electronic part constituting a part of the high frequency circuit is formed on the base material, and a conductor pattern electrically connected to the electrode of the electronic part is provided on the sheet material or the plate material.
Further, in this invention, those portions of the base material opposite to each other with the dielectric plate placed therebetween are formed as non-electrode-formation sections, and electrodes are formed on both main surfaces of the dielectric plate to thereby form a dielectric resonator and a ground surface, the high frequency circuit including a conductor pattern connected to the dielectric resonator.
In the high frequency module, the electronic part can be directly formed on the base material, so that it is possible to use a sheet material or a plate material on which such an electronic part cannot be directly formed. Further, in the high frequency module, it is possible to easily form a high frequency module including a dielectric resonator.
REFERENCES:
patent: 6087912 (2000-07-01), Sakamoto et al.
patent: 6150904 (2000-11-01), Taniguchi et al.
Iio Ken'ichi
Ishikawa Yohei
Sakamoto Koichi
Yamashita Sadao
Murata Manufacturing Co. Ltd.
Ostrolenk Faber Gerb & Soffen, LLP
Pascal Robert
Summons Barbara
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