Wave transmission lines and networks – Resonators – Dielectric type
Patent
1998-04-14
2000-07-11
Lee, Benny
Wave transmission lines and networks
Resonators
Dielectric type
333247, 331 96, 331107DP, 331117D, H01P 710
Patent
active
060879122
ABSTRACT:
An electronic module, comprising: a dielectric base plate having first and second opposing surfaces on which respective electrodes are disposed such that respective areas at the first and second surfaces are free of electrode material and aligned relative to one another to form a dielectric resonator; a first electronic component coupled to the base plate; and a first circuit sheet having first and second opposing surfaces, at least one aperture between the surfaces, and a conductor pattern disposed on the first surface, the first circuit sheet being disposed on the base plate such that: (i) the first electronic component is at least partially received within the aperture; and (ii) at least part of the conductor pattern is coupled to the dielectric resonator.
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Bierman H.: "Microwave Packages are Meeting GaAs Challenges" Microwave Journal, vol. 29, No. 11, Nov. 1986, pp. 26, 28, 31/32, 34, 36, 38/39 XP002042561, figure 1.
Iesekiel S. et al.: "Microwave Photonic Multichip Modules Packaged on A Glass-Silicon Substrate" IEEE Transactions on Microwave Theory and Techniques, vol. 43, No. 9, Part 02, Sep. 1995, pp. 2421-2426, XP000524239, figure 1.
Gheewala T. R.: "Packages For Ultra-High Speed GaAs ICS" Microelectronics Journal, vol. 16, No. 2, Mar. 1985, pp. 30-37, XP002046126, figure 1A.
European Search Report dated Jul. 24, 1998.
Iio Ken'ichi
Ishikawa Yohei
Sakamoto Koichi
Yamashita Sadao
Lee Benny
Murata Manufacturing Co. Ltd.
Summons Barbara
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