Wave transmission lines and networks – Long line elements and components – Strip type
Reexamination Certificate
1999-07-29
2002-11-19
Lee, Benny (Department: 2817)
Wave transmission lines and networks
Long line elements and components
Strip type
C257S728000
Reexamination Certificate
active
06483406
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a high-frequency module in which a high-frequency device-mounting package mounting a high-frequency device operating on high-frequency signals of from a microwave band to a millimeter-wave band, is mounted on an external circuit board. More particularly, the invention relates to a high-frequency module in which a high-frequency device-mounting package (hereinafter often referred to simply as high-frequency package) is connected to an external circuit board without deteriorating characteristics of the high-frequency signals.
2. Description of the Prior Art
Conventional representative high-frequency modules equipped with a high-frequency package mounting a high-frequency device that operates on high-frequency signals of microwaves and millimeter waves, have structures as shown in
FIGS. 11
a
and
11
b.
Referring, for example, to
FIG. 11
a
, a high-frequency package
80
comprises a dielectric substrate
82
mounting a high-frequency device
81
which is air-tightly sealed in a cavity
85
formed by a frame
83
and a closure
84
. On the surface of the dielectric substrate
82
are formed high-frequency signal transmission lines (hereinafter often referred to simply as high-frequency lines)
86
such as microstrip lines connected to the high-frequency device
81
. The high-frequency lines
86
are drawn out of the cavity
85
through the frame
83
and extend to the back surface of the dielectric substrate
82
passing over the side surfaces of the dielectric substrate
82
. That is, the high-frequency lines
86
on the back surface of the dielectric substrate
82
are connected to high-frequency lines
88
formed on an external circuit board
87
such as mother board through an electrically conducting material
89
such as solder. High-frequency signals are input to the high-frequency device
81
through the high-frequency lines
86
, or high-frequency signals are output to the high-frequency lines
86
from the high-frequency device
81
. In the high-frequency module equipped with a plurality of high-frequency packages
80
as shown in
FIG. 11
a
, furthermore, the high-frequency lines
86
on the back surface of the dielectric substrate
82
of each package
80
are connected to the high-frequency lines
88
of the external circuit board
87
, so that the high-frequency packages
80
are electrically connected to each other.
A high-frequency module shown in
FIG. 11
b
has the same structure as the high-frequency module of
FIG. 11
a
except that the high-frequency lines
86
formed on the front and back surfaces of the dielectric substrate
82
. of the high-frequency package
80
are connected together using the through-hole conductors
90
penetrating through the dielectric substrate
82
. In the high-frequency module of
FIG. 11
a
, the high-frequency lines
86
are drawn to the external side through the frame
83
, involving such defects that the high-frequency signals produce reflection loss and radiation loss at portions where the high-frequency lines
86
pass through the frame
83
and that characteristics of the high-frequency signals are deteriorated. Besides, since the high-frequency lines
86
are folded, high-frequency signals of the millimeter band produce a large reflection loss at the folded portions of the high-frequency lines
86
, making it difficult to transmit or receive signals. In the high-frequency module of
FIG. 11
b
, on the other hand, the high-frequency lines
86
formed on the front and back surfaces of the dielectric substrate
82
are connected together using the through-hole conductors
90
, offering an advantage in that the above-mentioned reflection loss and radiation loss are decreased.
In the above-mentioned high-frequency modules of
FIGS. 11
a
and
11
b
, however, the high-frequency lines
86
of the high-frequency package are connected to the high-frequency lines
88
of the external circuit board through the electrically conducting adhesive material
89
such as solder, making it very difficult to accomplish the alignment of the patterns of the high-frequency lines
86
and the patterns of the high-frequency lines
88
. Depending on the frequency of signals, therefore, there occurs reflection loss due to mismatching of the impedance at the connection portions using the electrically conducting adhesive material
89
, whereby the transmission loss so increases that it often becomes difficult to transmit signals of high frequencies.
SUMMARY OF THE INVENTION
The object of the present invention, therefore, is to provide a high-frequency module which enables the patterns of high-frequency lines of a high-frequency package to be easily aligned with the patterns of high-frequency lines of an external circuit board, enabling the transmission loss of high-frequency signals to be effectively decreased at the junction portions of these lines.
According to the present invention, there is provided a high-frequency module comprising a high-frequency device-mounting package and an external circuit board; wherein
the high-frequency device-mounting package includes a dielectric substrate having a first grounding layer contained therein, the dielectric substrate mounting a high-frequency device on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines connected to the high-frequency device, and having, formed on the other surface thereof, second high-frequency signal transmission lines coupled to the first high-frequency signal transmission lines;
the external circuit board is constituted by a dielectric board having third high-frequency signal transmission lines and a second grounding layer, the third high-frequency signal transmission lines being formed on one surface of the dielectric board, and the second grounding layer being formed on the other surface of the dielectric board or inside thereof; and
the high-frequency device-mounting package and the external circuit board are arranged side by side, and the second high-frequency signal transmission lines of the high-frequency device-mounting package are electrically connected to the third high-frequency signal transmission
lines of the external circuit board through linear electrically conducting members.
The invention further provides a high-frequency device-mounting package equipped with a dielectric substrate having a grounding layer contained therein; wherein
the dielectric substrate mounts a high-frequency device on one surface thereof and has, formed on one surface thereof, first high-frequency signal transmission lines connected to the high-frequency device, and has, formed on the other surface thereof, second high-frequency signal transmission lines coupled to the first high-frequency signal transmission lines; and
a connection portion is formed at the ends of the second high-frequency signal transmission lines for connecting linear electrically conducting members connected to an external circuit board.
In the high-frequency module of the present invention if briefly described, the high-frequency device-mounting package (high-frequency package) and the external circuit board are arranged side by side, and the second high-frequency signal transmission lines on the package and the third high-frequency signal transmission lines of the external circuit board are connected together through linear electrically conducting members such as wires, ribbons or electrically conducting tapes, making very important features. The module of the present invention having the above-mentioned structure offers an advantage in that when the high-frequency package is mounted on the external circuit board, the patterns of the second high-frequency signal transmission lines of the package can be (easily aligned with the patterns of the third high-frequency signal transmission lines of the external circuit board, producing a small high-frequency signal transmission loss between the lines.
In the present invention, the first high-frequency signal transmission lines formed on
Kitazawa Kenji
Koriyama Shin-ichi
Minamiue Hidehiro
Sawa Yoshinobu
Hogan & Hartson LLP
Lee Benny
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