High frequency module provided with power amplifier

Details High frequency module provided with power amplifier High frequency module provided with power amplifier

2011-07-12

2011-07-12

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C361S761000

Reexamination Certificate

active

07978031

ABSTRACT:
The present invention is provided with a high frequency module comprising a multilayered substrate, a power amplifier IC mounted on the upper surface of the multilayered substrate, first and second filters disposed substantially directly below the power amplifier IC in an inner layer of the multilayered substrate, and coupling-reducing ground vias disposed between the first filter and the second filter. At least the first filter is disposed substantially directly below the power amplifier IC. The coupling-reducing ground vias double as thermal vias for dissipating heat generated by the power amplifier IC.

REFERENCES:
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Office Action dated Jan. 5, 2010 in related JP application 2008-022152, with translation/.

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