Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-09-27
2005-09-27
Gibson, Randy (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S768000, C174S260000
Reexamination Certificate
active
06950315
ABSTRACT:
In a high-frequency module mounting structure according to the present invention, a circuit board includes a reinforcing electrode on the lower surface thereof for increasing a mounting strength of the first and second electrode groups in a state of being in close proximity, a motherboard includes a reinforcing lands corresponding to the reinforcing electrodes in a state of being in close proximity to the lands, and the electrodes and the lands, and the reinforcing electrodes and the reinforcing lands are soldered. Therefore, soldering of the high-frequency module with respect to the motherboard is enhanced, and thus a reliable high-frequency module mounting structure is provided.
REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 5641946 (1997-06-01), Shim
patent: 6107685 (2000-08-01), Nishiyama
patent: 6346679 (2002-02-01), Nakamura
patent: 2001-7467 (2001-01-01), None
Murata Atsushi
Shibata Daijo
Terashima Kiminori
Ujiie Masanobu
Alps Electric Co. ,Ltd.
Brinks Hofer Gilson & Lione
Dinh Tuan
Gibson Randy
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