High frequency module including a flexible substrate

Wave transmission lines and networks – Coupling networks – With impedance matching

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Details

333033, 333193, 333247, 310313R, 257728, 174 521, 174 524, 361751, 361761, H05K 702, H03H 964, H03H 1128

Patent

active

054383056

ABSTRACT:
A high frequency module is disclosed which comprises a high frequency device in a package, a circuit formed on a flexible substrate in the package, the circuit, the high frequency device and input/output terminals of the package being connected electrically.

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Ohsaki, Takaki. "Electronic Packaging in the 1990's-A Perspective from Asia," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 14, No. 2, Jun. 1991, pp. 254-261.

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