High-frequency module and method for manufacturing the same

Details High-frequency module and method for manufacturing the same High-frequency module and method for manufacturing the same

2006-07-25

2006-07-25

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S728000, C257S434000, C257S701000, C257S704000, C257S699000, C257S707000, C257S729000, C257S698000, C257S690000, C257S787000, C257S693000, C257S730000, C257S664000, C257S666000, C257S659000, C257S703000, C257S678000, C257S790000, C257S675000, C257S684000, C257S708000

Reexamination Certificate

active

07081661

ABSTRACT:
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.

REFERENCES:
patent: 5455384 (1995-10-01), Ichihara
patent: 5574314 (1996-11-01), Okada et al.
patent: 5898344 (1999-04-01), Hayashi
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 6262513 (2001-07-01), Furukawa et al.
patent: 6329711 (2001-12-01), Kawahara et al.
patent: 6365961 (2002-04-01), Tomie
patent: 6376921 (2002-04-01), Yoneda et al.
patent: 4-58596 (1992-02-01), None
patent: 9-307261 (1997-11-01), None
patent: 11-150143 (1999-06-01), None
patent: 2000-223647 (2000-08-01), None
patent: 2001-244688 (2001-09-01), None

Affiliated with

Also associated with

Rating

High-frequency module and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-frequency module and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-frequency module and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3571654