High-frequency module and its manufacturing method

Details High-frequency module and its manufacturing method High-frequency module and its manufacturing method

2006-06-20

2006-06-20

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Coupling networks

Wave filters including long line elements

C333S133000

Reexamination Certificate

active

07064630

ABSTRACT:
The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.

REFERENCES:
patent: 5717249 (1998-02-01), Yoshikawa
patent: 5929510 (1999-07-01), Geller et al.
patent: 6057600 (2000-05-01), Kitazawa et al.
patent: 6456172 (2002-09-01), Ishizaki et al.
patent: 6797890 (2004-09-01), Okubora et al.
patent: 05-63408 (1993-03-01), None
patent: 08-335836 (1996-12-01), None
patent: 2001-102511 (2001-04-01), None

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