High-frequency module and communication apparatus

Details High-frequency module and communication apparatus High-frequency module and communication apparatus

2006-12-26

2006-12-26

Anderson, Matthew (Department: 2684)

Telecommunications

Receiver or analog modulated signal frequency converter

Cabinet, housing, or chassis structure

C455S325000, C333S133000, C333S193000

Reexamination Certificate

active

07155197

ABSTRACT:
In a high-frequency module, intermediate ground electrodes are provided between a common ground electrode and upper-surface ground electrodes for mounting high-frequency components on an upper surface of a multilayer substrate. With regard to the number of via-hole conductors interconnecting ground electrodes, the number of via-hole conductors between the intermediate ground electrodes and the common ground electrode is larger than the number of via-hole conductors between the upper-surface ground electrodes and the intermediate ground electrodes.

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Official Communication Issued in the corresponding Chinese Application No. 200310102868.4 and dispatched on Aug. 12, 2005 (with full English translation).
Official Communication Issued in the corresponding Korean Application No. 10-2003-0073801 and dispatched on Oct. 7, 2005 (with full English translation).
Official Communication issued in the corresponding European Application No. 03022912.4, mailed on Sep. 21, 2006.

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