High frequency module

Details High frequency module High frequency module

2005-04-05

2005-04-05

Smith, Creighton (Department: 2645)

Telecommunications

Radiotelephone system

Reexamination Certificate

active

06876846

ABSTRACT:
Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

REFERENCES:
patent: 20010054944 (2001-12-01), Sakamoto et al.
patent: 20020036054 (2002-03-01), Nakatani et al.
patent: 2-69967 (1990-03-01), None
patent: 8-18002 (1996-01-01), None

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