High-frequency module

Details High-frequency module High-frequency module

2007-08-24

2009-08-25

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S126000, C333S129000

Reexamination Certificate

active

07579930

ABSTRACT:
A high-frequency module is integrally formed from at least some circuit components defining a first wireless system using a first frequency band and at least some circuit components defining a second wireless system using a second frequency band. The high-frequency module includes a multilayer substrate including a plurality of stacked dielectric layers, a first terminal group disposed on a first surface of the multilayer substrate, where a plurality of terminals are arranged along a first side of four sides defining the first surface, and a second terminal group disposed on the first surface, where a plurality of terminals are arranged along a second side that is different from the first side. The first terminal group includes a first antenna terminal of the first wireless system whereas the second terminal group includes a second antenna terminal of the second wireless system.

REFERENCES:
patent: 6380823 (2002-04-01), Ikata et al.
patent: 7245882 (2007-07-01), McFarland
patent: 10-150395 (1998-06-01), None
patent: 2000-349586 (2000-12-01), None
patent: 2001-119201 (2001-04-01), None
patent: 2001-352272 (2001-12-01), None
patent: 2002-64400 (2002-02-01), None
patent: 2003-179464 (2003-06-01), None
patent: 2003-179515 (2003-06-01), None
patent: 2004-7756 (2004-01-01), None
patent: 2004-199114 (2004-07-01), None
patent: 2004-350068 (2004-12-01), None
patent: 2006-014102 (2006-01-01), None
Official Communication for PCT Application No. PCT/JP2006/302449; mailed May 23, 2006.
Official Communication in counterpart Japanese Application No. JP 2006-526474; mailed Dec. 19, 2006.
Official communication issued in counterpart Korean Application No. 10-2007-7022659, mailed on Jul. 21, 2008.

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