High frequency module

Details High frequency module High frequency module

2007-01-16

2007-01-16

D'Agosta, Steve M. (Department: 2645)

Telecommunications

Radiotelephone system

C455S189100, C455S293000, C455S311000, C455S313000, C455S323000, C333S247000

Reexamination Certificate

active

11070231

ABSTRACT:
Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

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patent: 2-69967 (1990-03-01), None
patent: 8-18002 (1996-01-01), None

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