Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2005-06-14
2005-06-14
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C361S718000, C361S719000, C257S713000, C257S704000, C257S707000, C257S728000
Reexamination Certificate
active
06906259
ABSTRACT:
An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present invention employs a substrate11, a semiconductor chip13fixed on the substrate11, a roof plate15being contact with an upper surface13aof the semiconductor chip13, and a cap, which is contact with an upper surface of the roof plate, having a flat portion16aand extended portions16bleaded out below from opposite ends of the flat portion16a. The extended portions16bof the cap16are contact with side surfaces of the substrate11. Thus, a wide area contact between the extended portions16bof the cap16and the side surfaces of the substrate11can be ensured even if the height of the semiconductor chip13fluctuates or the shape of the cap16fluctuates. This results that heat generated from the semiconductor chip13is efficiently radiated to the substrate11.
REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5831836 (1998-11-01), Long et al.
patent: 5832598 (1998-11-01), Greenman et al.
patent: 5973923 (1999-10-01), Jitaru
patent: 6091603 (2000-07-01), Daves et al.
patent: 6163456 (2000-12-01), Suzuki et al.
patent: 6294731 (2001-09-01), Lu et al.
patent: 10-501102 (1998-01-01), None
Brown & Raysman Millstein Felder & Steiner LLP
Ngo Hung V.
LandOfFree
High frequency module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High frequency module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High frequency module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3477621