High frequency module

Details High frequency module High frequency module

2005-03-29

2005-03-29

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S704000, C257S713000

Reexamination Certificate

active

06873529

ABSTRACT:
There is presented a high frequency module, in which a recess2afor mounting power amplifier device is formed on a lower surface of a dielectric substrate2, and a recess2bfor mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate2, and a power amplifier device4and a surface acoustic wave filter8are mounted through conductive bumps3aand3bon the recesses2aand2b, respectively. In addition, a through-hole conductor11whose one end is exposed at the lower surface of the dielectric substrate2is provided between the recesses2aand2b. The exposed end of the through-hole conductor11is attached to a thermal dissipation conductor15on an upper surface of an external electric circuit board7through a brazing material13.

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