High frequency module

Telecommunications – Transmitter and receiver at same station – With transmitter-receiver switching or interaction prevention

Reexamination Certificate

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Details

C455S080000

Reexamination Certificate

active

07965989

ABSTRACT:
A high frequency module includes a layered substrate and an element for outputting a reception signal in a balanced state. The element includes a first and a second output terminal and is mounted on the top surface of the layered substrate. A first and a second reception signal terminal are disposed on the bottom surface of the layered substrate. The high frequency module further includes a first signal path connecting the first output terminal and the first reception signal terminal to each other, and a second signal path connecting the second output terminal and the second reception signal terminal to each other. The first and second signal paths are each formed using one or more through holes provided inside the layered substrate, and are not exposed at any side surface of the layered substrate.

REFERENCES:
patent: 6900705 (2005-05-01), Nakamura et al.
patent: 6906411 (2005-06-01), Katsura et al.
patent: 7176768 (2007-02-01), Nakamura et al.
patent: 7224240 (2007-05-01), Nakamura et al.
patent: 2004/0248539 (2004-12-01), Furutani et al.
patent: A 2003-142981 (2003-05-01), None
patent: A 2003-338724 (2003-11-01), None
patent: A 2004-364051 (2004-12-01), None
patent: A-2005-260835 (2005-09-01), None
patent: A-2005-303757 (2005-10-01), None
patent: A-2005-311929 (2005-11-01), None
patent: A-2008-017439 (2008-01-01), None
patent: WO 02/01931 (2002-01-01), None
Iwata M., U.S. Appl. No. 11/723,359, filed Mar. 19, 2007.

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