High-frequency interconnection for circuits

Details High-frequency interconnection for circuits High-frequency interconnection for circuits

2005-01-04

2005-01-04

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S247000

Reexamination Certificate

active

06838953

ABSTRACT:
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

REFERENCES:
patent: 4890155 (1989-12-01), Miyagawa et al.
patent: 5313693 (1994-05-01), Cachier
patent: 5528074 (1996-06-01), Goto et al.
patent: 5982250 (1999-11-01), Hung et al.
patent: 6118357 (2000-09-01), Tomasevic et al.
patent: 6175287 (2001-01-01), Lampen et al.
patent: 6201454 (2001-03-01), Kinayman et al.
patent: 6469592 (2002-10-01), Huang et al.
patent: 0 718 905 (1996-06-01), None
patent: 63124102 (1989-11-01), None
patent: WO 9927646 (1999-06-01), None

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