Active solid-state devices (e.g. – transistors – solid-state diode – With passive device
Reexamination Certificate
2007-03-13
2007-03-13
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
With passive device
C257S728000, C257SE23057
Reexamination Certificate
active
10041318
ABSTRACT:
A high frequency integrated circuit includes a die, a package and capacitive bond. The die includes a circuit that processes a high frequency signal and also includes at least one bonding pad coupled to the circuit. The package includes a plurality of bonding posts, at least one of the bonding posts is allocated to the at least one bond pad of the die. A bonding capacitor couples the at least one bond pad on the die to the at least one bond post of the package.
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Cave Michael
Markison Timothy
May Michael
Rybicki Mathew
Pert Evan
Sandvik Benjamin P.
ViXS Systems Inc.
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