High frequency IC package

Details High frequency IC package High frequency IC package

1993-06-11

1995-05-23

Ledynh, Bot

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174260, 174261, 257691, 361736, H05K 506

Patent

active

054183294

ABSTRACT:
A high frequency IC package includes a dielectric package body having a surface, a high frequency signal transmission line and a power supply line disposed on the surface of the package body, a high frequency IC chip disposed on the surface of the package body and electrically connected to the high frequency signal transmission line and the power supply line by wires, and a lid hermetically sealing and shielding the IC chip. The lid includes a plane part parallel to the surface of the IC chip and side walls, perpendicular to the plane part, surrounding the IC chip. Since the side wall is not present on the surface of the package body but included in the lid, during the wire-bonding process of the IC chip, unfavorable contact between the cavity wall and bonding tool is avoided, reducing the lengths of bonding wires and signal transmission lines. As the result, reflection loss, conductor loss, and cavity resonance are reduced.

REFERENCES:
patent: 3721746 (1973-03-01), Knappenberger
patent: 4370515 (1983-01-01), Donaldson
patent: 4658334 (1987-04-01), McSparran et al.

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