High frequency hermetically sealed package for solid-state compo

Details High frequency hermetically sealed package for solid-state compo High frequency hermetically sealed package for solid-state compo

1986-02-05

1988-02-02

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

357 74, 357 80, 357 81, 174 52FP, H05K 330

Patent

active

047221372

ABSTRACT:
A package for discrete components is hermetically sealed, has very low parasitic inductance and capacitance, small size, 50 ohm input and output leads and is suitable for surface mount applications. The package comprises a ceramic base and a ceramic lid, hermetically sealed together with a solder glass seal. The ceramic base has metallized areas deposited on only the top side, to which the leads are brazed. The contacts of the component are mounted directly to the leads. After brazing, the braze and leads are nickel plated. Then a photoresist mask layer is applied to the area where the solder glass seal will be made and the photoresist is cured. The nickel plating is deoxidized and the gold plating is applied. Next, the photoresist layer is removed, exposing the nickel plating and alumina in the seal area so that the lid can be attached with the solder glass to form an effective hermetic seal.

REFERENCES:
patent: 3404319 (1968-10-01), Tsuji et al.
patent: 3665592 (1972-05-01), Apospors
patent: 3748544 (1973-07-01), Noren
patent: 3893193 (1975-07-01), Anazawa et al.
patent: 3936864 (1976-02-01), Benjamin
patent: 4023198 (1977-05-01), Malone et al.
patent: 4137628 (1979-02-01), Suzuki
patent: 4246697 (1981-01-01), Smith
patent: 4527010 (1985-07-01), Anazawa et al.

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