High-frequency hermetically-sealed circuit package

Details High-frequency hermetically-sealed circuit package High-frequency hermetically-sealed circuit package

2009-01-13

2010-11-23

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S664000, C257S693000, C257S701000, C257S730000, C257SE23181

Reexamination Certificate

active

07838990

ABSTRACT:
A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

REFERENCES:
patent: 3784884 (1974-01-01), Zoroglu
patent: 4150393 (1979-04-01), Wilson et al.
patent: 4427991 (1984-01-01), Yamamura et al.
patent: 4626805 (1986-12-01), Jones
patent: 4713634 (1987-12-01), Yamamura
patent: 5406120 (1995-04-01), Jones
patent: 6441697 (2002-08-01), Garland et al.
patent: 6455932 (2002-09-01), Katahira
patent: 6559533 (2003-05-01), Yamamoto
patent: 2001-35948 (2001-02-01), None

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