Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate
2006-03-07
2006-03-07
Song, Sarah (Department: 2874)
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
C385S093000, C385S092000
Reexamination Certificate
active
07008120
ABSTRACT:
An apparatus and packaging scheme that ensures that alignments between signal sending and detecting components in transceivers are optimized and maintained over the lifetime of the apparatus. This is accomplished through use of a pair of polymer optical modules, which are used to couple light sent to and received from respective fiber optic cables. During a pre-alignment process, head portions of the polymer optical modules are inserted into respective slots defined in a standoff that is mounted on an optical sub-assembly to which an emitter and detector are mounted, whereby these slots are configured so that the head portions slide along the sidewalls of the slots during assembly. During a subsequent active alignment process, each polymer optical module is positioned relative to its respective emitter or detector until a maximum signal is detected, whereupon the position of the components is quick-set using a UV-sensitive adhesive.
REFERENCES:
patent: 5295214 (1994-03-01), Card et al.
patent: 5475783 (1995-12-01), Kurashima
patent: 5515468 (1996-05-01), DeAndrea et al.
patent: 6409397 (2002-06-01), Weigert
patent: 6454470 (2002-09-01), Dwarkin et al.
patent: 6692161 (2004-02-01), Zaborsky et al.
patent: PCT/US 02/07012 (2003-07-01), None
“Alignment Fixture for Radio Frequency Shield to Deck Reflow”; IBM Technical Disclosure Bulletin; IBM Corp. New York, US; vol. 34; No. 10B, Mar. 1, 1992, pp. 124-125.
Alduino Andrew
Crafts Douglas
Fleischer Siegfried
Peddada Rao
Zaborsky Brett
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Song Sarah
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