High frequency electrical connector comprising multilayer circui

Electrical connectors – Electromagnetic or electrostatic shield – Multi-part shield body

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Details

439 65, 439 47, H01R 907, H01R 13648

Patent

active

051023520

ABSTRACT:
A high frequency electrical connector for an integrated circuit such as a microprocessor comprises a board assembly comprising a series of conductive and insulating layers of preselected thicknesses arranged alternately, one on top of the other, with conductive layers adjacent front and rear faces. Ground and current source pins are implanted in the layers with connecting portions for external circuitry outstanding from at least one of the faces and with conductive layer contacting portions establishing electrical connection with selected conductive layers. Ground pins connect the conductive layers adjacent the front and rear faces providing front and rear ground shield layers. The layers may be corrugated providing shielding portions extending in the direction of the pins. The thicknesses of the layers and the separation of the pins are preselected to provide pin impedances matching those of other connecting devices.

REFERENCES:
patent: 3208029 (1965-09-01), Leslie
patent: 3932932 (1976-01-01), Goodman
patent: 4208080 (1980-06-01), Teagno
patent: 4494172 (1985-01-01), Leary et al.
patent: 4859806 (1989-08-01), Smith

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