Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate
2006-02-14
2006-02-14
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
C257S678000
Reexamination Certificate
active
06998710
ABSTRACT:
A high-frequency device has a semiconductor substrate; a high-frequency circuit layer formed on the substrate and including a circuit element and a multilayer wiring layer; electrically conductive pads; rewiring layers connected to the electrically conductive pads; an electrically insulating sealing layer formed on the first electrically insulating layer and the rewiring layer and having a thickness larger than the multilayer wiring layer; electrically conductive posts provided inside the electrically insulating sealing layer and between the rewiring layer and the mounting connection terminals. A first electrically conductive post corresponding to a power source has a first diameter; a second electrically conductive post corresponding to an input of input amplifier has a second diameter less than the first diameter; and a third electrically conductive post corresponding to an output of power output amplifier has a third diameter larger than the second diameter.
REFERENCES:
patent: 9-306917 (1997-11-01), None
patent: 10-64953 (1998-03-01), None
patent: 2002-313930 (2002-10-01), None
patent: 2003-243570 (2003-08-01), None
Kobayashi Kazuhiko
Kondo Fumitaka
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Owens Douglas W
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