High frequency component and communication apparatus...

Details High frequency component and communication apparatus... High frequency component and communication apparatus...

2005-03-15

2005-03-15

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S800000, C361S816000, C361S818000, C174S034000, C174S051000

Reexamination Certificate

active

06867982

ABSTRACT:
A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.

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patent: 52-117242 (1976-03-01), None
patent: 9-191206 (1997-07-01), None
patent: 11-224911 (1999-08-01), None

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