High frequency component

Wave transmission lines and networks – Plural channel systems – Having branched circuits

Reexamination Certificate

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Details

C333S02400C, C333S109000

Reexamination Certificate

active

07026884

ABSTRACT:
The invention relates to a high frequency component of layered structure, and a method for manufacturing the component. The component comprises at least one dielectric layer parallel to the layers of the layered structure, at least two transmission lines for transmitting electrical signals, at least one capacitor, each of which is formed by overlapping parts of two transmission lines, the overlapping parts being for forming capacitive interaction between the parts, and the overlapping parts being arranged to overlap each other in a transversal direction to a dielectric layer parallel to the layers of the layered structure, the dielectric layer being in between the overlapping parts.

REFERENCES:
patent: 3012210 (1961-12-01), Nigg
patent: 4216446 (1980-08-01), Iwer
patent: 6611181 (2003-08-01), Marketkar et al.
patent: WO 02/069440 (2002-09-01), None
“Microstrip Realisation of Loosely Coupled Conductors with Enhanced Directivity”; S.R. Mercer; Electronics Letters 16th; vol. 31, No. 4, pp. 295-296 (Feb. 1995).
“Novel Stripline Coupler for Multilayer Ceramic Integrated Circuit (MCIC) Applications”; Sarmad Al-Taei et al.; Microwave Symposium Digest, 2001 IEEE MTT-S International, vol. 1, pp. 51-54 (May 20-25, 2001).
“A Study of Microstrip Coupler with High Directivity”, Jin Lin, 1998 IEEE, pp. 905-908.
“Microstrip Realisation of Loosely Coupled Conductors with Enhanced Directivity”, S.R. Mercer, Electronics Letters Feb. 16, 1995, vol. 31, No. 4, pp. 295-296.
“Microstrip Directional Couplers with Ideal Performance Via Single-Element Compensation”, Michael Dydyk, IEEE Transactions on Microwave Theory and Techniques, vol. 47, No. 6, Jun. 1999.

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